The director of the US National Institute of Standards and Technology (NIST), Laurie Locascio, states that “we envision that America will both manufacture and package the world’s most sophisticated chips within a decade.” This entails “both onshoring a high-volume advanced packaging industry that is self-sustaining, profitable, and environmentally sound, as well as conducting the research to accelerate new packaging approaches to market.”
The goals, vision, and purpose of the advanced packaging programme established by the Chips Act are described in “The Vision for the National Advanced Packaging Manufacturing Programme” (NAPMP).